• AIP 300

    300mm 웨이퍼 자동화 설비

    - Feature
    # 300mm CMP System
    # Full Automatic
    # 2 Cassettes, 2 Load Ports
    # EFFM Robot 4 Axis
    # Transfer Robot 3 Axis
    # 1Platen 1Head
    # 2 Slurry Pumps
    # 2 Chambers Brushes, 2 Chemical Used (SC1, HF, NH4OH
    # Spin Dryer (0 ~ 2500 rpm)
    # Wafer Dry-in / Dry - Out

    - Application
    # Semiconductor
    # Mems
    # University Laboratory : High quality performance test
    # CMP process service

    - Model Description
    Model UNIT Items Type
    AIP 300 CARRIER Motion Rotation / Oscillation
    Head type Membrane / Retainer Ring
    PLATEN Motion Rotation
    Rotation Speed MAX 200 rpm
    Pad 30“
    CONDITIONER Motion Rotation / Sweep
    Dressing In / Ex-situ
    DD size 4“
    OTHERS Slurry Supply Top down
    Pad Clean High Pressure DIW
    Wafer In-Out Dry In/Wet Out
    EFEM Robot 4-axis
    2Foup Auto Mapping
    Input High Pressure Vertical
    Transfer Robot 3-axis
    Cleaner #1,#2 Chemical Use HF, HN4OH, SC1
    Brush Clean Double Sid Scrubbing
    SRD Scanning Nozzle D.I Water
    Motion Rotation