• AP 300™_Single Polisher

    - Feature
    # High Process Performance
    # Excellent Reliability Procure
    # CMP Consumable Part Test
    # Various Wafer Polishing

    - Application
    # Semiconductor CMP Process ; W, CU, ILD, IMD,Etc
    # CMP Slurry Chemical,DiamondDisk,CMP PAD

    - Model Description
    Model UNIT Items Type
    AP 300™ POLISH CARRIER (HEAD) Motion Rotation/Oscillation
    Head type Membrane / Retainer Ring
    PLATEN Motion Rotation
    Rotation Speed MAX 190 rpm
    Pad 30”
    CONDITIONER Motion Rotation / Sweep
    Dressing In/ Ex-situ
    DD size 4 “
    OTHERS Slurry Supply Top down
    Pad Clean High Pressure DIW
    Wafer In-Out Dry In/Wet Out