• ScS 300™_Wafer cleaner

    - Feature
    # Non-contact clean by DIW High pressure.
    # Wafer Vertical Clean(Only Input Station).
    # Mechanical Double Side Scrubbing with PVA brush at Clean-2 & 3 station.
    # Chemical Flows into the Brush & Spray Cleaning.
    # Brush Up, Down Control

    - Application
    # Post CMP Wafer Cleaning
    # Automatic wafer handling
    # Silicon,Tungsten,Cu,Sapphir and various other materials
    # Post Deposition Wafer Cleaning

    - Model Description
    Model UNIT Items Type
    ScS 300™ EFEM Robot 4-axis
    2Foup Auto Mapping
    Input High Pressure Vertical
    Transfer Robot 3-axis
    Cleaner#1,#2 Chemical Use HF,NH4OH,SC1
    Brush Clean Double Side Scrubbing
    SRD Scanning Nozzle D.I.Water
    Motion Rotation