ScS 300™_Wafer cleaner

- Feature
# Non-contact clean by DIW High pressure.
# Wafer Vertical Clean(Only Input Station).
# Mechanical Double Side Scrubbing with PVA brush at Clean-2 & 3 station.
# Chemical Flows into the Brush & Spray Cleaning.
# Brush Up, Down Control

- Application
# Post CMP Wafer Cleaning
# Automatic wafer handling
# Silicon,Tungsten,Cu,Sapphir and various other materials
# Post Deposition Wafer Cleaning

- Model Description

Model	UNIT	Items	Type
ScS 300™	EFEM	Robot	4-axis
		2Foup	Auto Mapping
	Input	High Pressure	Vertical
	Transfer	Robot	3-axis
	Cleaner#1,#2	Chemical Use	HF,NH4OH,SC1
		Brush Clean	Double Side Scrubbing
	SRD	Scanning Nozzle	D.I.Water
		Motion	Rotation