AP 200

100mm, 150mm 웨이퍼 싱글 폴리싱

- Feature
# 200mm Single Polisher System
# Semi Automatic
# 1Platen 1Head
# 2 Slurry Pumps
# In & Ex-situ Pad Conditioning : 10 Zones
# Menbrane Head Type
# 4,6,8 Inch Polishing Available

- Application
# Semiconductor
# Mems
# University Laboratory : High quality performance test
# CMP process service

- Model Description

Model	UNIT	Items	Type
AP 200	CARRIER	Motion	Rotation / Oscillation
		Head type	Membrane / Retainer Ring
	PLATEN	Motion	Rotation
		Rotation Speed	MAX 200 rpm
		Pad	20 inch
	CONDITIONER	Motion	Rotation / Sweep
		Dressing	In / Ex-situ
		DD size	4 “
	OTHERS	Slurry Supply	Top down
		Pad Clean	High Pressure DIW
		Wafer In-Out	Dry In/Wet Out