• AP 200

    100mm, 150mm 웨이퍼 싱글 폴리싱

    - Feature
    # 200mm Single Polisher System
    # Semi Automatic
    # 1Platen 1Head
    # 2 Slurry Pumps
    # In & Ex-situ Pad Conditioning : 10 Zones
    # Menbrane Head Type
    # 4,6,8 Inch Polishing Available

    - Application
    # Semiconductor
    # Mems
    # University Laboratory : High quality performance test
    # CMP process service

    - Model Description
    Model UNIT Items Type
    AP 200 CARRIER Motion Rotation / Oscillation
    Head type Membrane / Retainer Ring
    PLATEN Motion Rotation
    Rotation Speed MAX 200 rpm
    Pad 20 inch
    CONDITIONER Motion Rotation / Sweep
    Dressing In / Ex-situ
    DD size 4 “
    OTHERS Slurry Supply Top down
    Pad Clean High Pressure DIW
    Wafer In-Out Dry In/Wet Out