AIP 300

300mm wafer full Automatic

- Feature
# 300mm CMP System
# Full Automatic
# 2 Cassettes, 2 Load Ports
# EFFM Robot 4 Axis
# Transfer Robot 3 Axis
# 1Platen 1Head
# 2 Slurry Pumps
# 2 Chambers Brushes, 2 Chemical Used (SC1, HF, NH4OH
# Spin Dryer (0 ~ 2500 rpm)
# Wafer Dry-in / Dry - Out

- Application
# Semiconductor
# Mems
# University Laboratory : High quality performance test
# CMP process service

- Model Description

Model	UNIT	Items	Type
AIP 300	CARRIER	Motion	Rotation / Oscillation
		Head type	Membrane / Retainer Ring
	PLATEN	Motion	Rotation
		Rotation Speed	MAX 200 rpm
		Pad	30“
	CONDITIONER	Motion	Rotation / Sweep
		Dressing	In / Ex-situ
		DD size	4“
	OTHERS	Slurry Supply	Top down
		Pad Clean	High Pressure DIW
		Wafer In-Out	Dry In/Wet Out
	EFEM	Robot	4-axis
		2Foup	Auto Mapping
	Input	High Pressure	Vertical
	Transfer	Robot	3-axis
	Cleaner #1,#2	Chemical Use	HF, HN4OH, SC1
		Brush Clean	Double Sid Scrubbing
	SRD	Scanning Nozzle	D.I Water
		Motion	Rotation