AP 300™_Single Polisher

- Feature
# High Process Performance
# Excellent Reliability Procure
# CMP Consumable Part Test
# Various Wafer Polishing

- Application
# Semiconductor CMP Process ; W, CU, ILD, IMD,Etc
# CMP Slurry Chemical,DiamondDisk,CMP PAD

- Model Description

Model	UNIT	Items	Type
AP 300™	POLISH CARRIER (HEAD)	Motion	Rotation/Oscillation
		Head type	Membrane / Retainer Ring
	PLATEN	Motion	Rotation
		Rotation Speed	MAX 190 rpm
		Pad	30”
	CONDITIONER	Motion	Rotation / Sweep
		Dressing	In/ Ex-situ
		DD size	4 “
	OTHERS	Slurry Supply	Top down
		Pad Clean	High Pressure DIW
		Wafer In-Out	Dry In/Wet Out