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Stand-alone Polisher

AP-300

AP-200

AP-300

300mm Wafer Polishing, Oxide, Metal

Process Performance

High-performance CMP process
Advanced carrier with 5-zone pressure control
All available 300mm CMP process
In-situ and ex-situ pad conditioning(13zone)
Carrier linear oscillation
H.P rinse ▷dual type spray nozzle

Hardware Performance

Spindle rotation control ▷DDR motor
Trend data review
Temp, motor torque
CIP pad conditioner
Calibration Table

Model Description

Model	UNIT	Items	Type
AP 300™	POLISH CARRIER (HEAD)	Motion	Rotation/Oscillation
	POLISH CARRIER (HEAD)	Head type	Membrane / Retainer Ring
	PLATEN	Motion	Rotation
		Rotation Speed	MAX 190 rpm
		Pad	30”
	CONDITIONER	Motion	Rotation / Sweep
		Dressing	In/ Ex-situ
		DD size	4 “
	OTHERS	Slurry Supply	Top down
		Pad Clean	High Pressure DIW
		Wafer In-Out	Dry In/Wet Out