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Stand-alone Polisher

AP-300

AP-200

100, 150, 200mm Wafer Polishing, Oxide, Metal

Process Performance

In-situ and ex-situ pad conditioning(10zone)
Carrier linear oscillation
Membrane type CMP HEAD(4”,6”,8”)
Overall uniformity of wafers is good
Stable wafer polishing

Hardware Performance

Head replacement work method is easy
Various wafer sizes polishing
Stable wafer polishing
Wafer load cup

Model Description

Model	UNIT	Items	Type
AP 200	CARRIER	Motion	Rotation / Oscillation
	CARRIER	Head type	Membrane / Retainer Ring
	PLATEN	Motion	Rotation
		Rotation Speed	MAX 200 rpm
		Pad	20 inch
	CONDITIONER	Motion	Rotation / Sweep
		Dressing	In / Ex-situ
		DD size	4 “
	OTHERS	Slurry Supply	Top down
		Pad Clean	High Pressure DIW
		Wafer In-Out	Dry In/Wet Out