SAERO2-K2
Automatic 200mm CMP System.
Mass production equipment
Process Performance
- High throughput ▷60wph(1Step 60sec)
- Edge zone pressure control
- New concept of CMP HEAD to improve edge performance
- In-situ and ex-situ pad conditioning(10 zone)
- Low-pressure range control ▷0.15psi~14psi
Hardware Performance
- 4-Cassette,2-Platen 4-Head, Post Cleaner
- The wafer movement of the Cleaner is a roller
- Wafer load unit motor control
- Double Side PVA Brush Cleaning
- SDA sweep motion function
- Other CMP HEAD can be use
- Model Description
| Model | UNIT | Items | Type |
|---|---|---|---|
| AIP 300 | CARRIER | Motion | Rotation / Oscillation |
| Head type | Membrane / Retainer Ring | ||
| PLATEN | Motion | Rotation | |
| Rotation Speed | MAX 200 rpm | ||
| Pad | 30“ | ||
| CONDITIONER | Motion | Rotation / Sweep | |
| Dressing | In / Ex-situ | ||
| DD size | 4“ | ||
| OTHERS | Slurry Supply | Top down | |
| Pad Clean | High Pressure DIW | ||
| Wafer In-Out | Dry In/Wet Out | ||
| EFEM | Robot | 4-axis | |
| 2Foup | Auto Mapping | ||
| Input | High Pressure | Vertical | |
| Transfer | Robot | 3-axis | |
| Cleaner #1,#2 | Chemical Use | HF, HN4OH, SC1 | |
| Brush Clean | Double Sid Scrubbing | ||
| SRD | Scanning Nozzle | D.I Water | |
| Motion | Rotation |