AIP-300
Automatic 300mm CMP System. Dry-in, Dry-out
Process Performance
- High grade CMP process
- Advanced carrier with 5zone pressure control
- Customized wafer flow sequence per chamber
Hardware Performance
- 2-Cassette foup
- 2-Wafer transfer robot
- 2-Monitor panel
- 1Platen+1Head
- 2Chemical unit, double side brush clean
- Model Description
| Model | UNIT | Items | Type |
|---|---|---|---|
| AIP 300 | CARRIER | Motion | Rotation / Oscillation |
| Head type | Membrane / Retainer Ring | ||
| PLATEN | Motion | Rotation | |
| Rotation Speed | MAX 200 rpm | ||
| Pad | 30“ | ||
| CONDITIONER | Motion | Rotation / Sweep | |
| Dressing | In / Ex-situ | ||
| DD size | 4“ | ||
| OTHERS | Slurry Supply | Top down | |
| Pad Clean | High Pressure DIW | ||
| Wafer In-Out | Dry In/Wet Out | ||
| EFEM | Robot | 4-axis | |
| 2Foup | Auto Mapping | ||
| Input | High Pressure | Vertical | |
| Transfer | Robot | 3-axis | |
| Cleaner #1,#2 | Chemical Use | HF, HN4OH, SC1 | |
| Brush Clean | Double Sid Scrubbing | ||
| SRD | Scanning Nozzle | D.I Water | |
| Motion | Rotation |